HI-1565, HI-1566
V
DD
Each Bus
Isolation
Transformer
TXA/B
TXA/B
RXA/B
RXA/B
BUS A/B
55W
35W
MIL-STD-1553
Transceiver
1:2.5
BUS A/B
55W
HI-1565 / HI-1566
GND
Point
“AD”
Figure 3. Direct Coupled Test Circuit
V
DD
Each Bus
Isolation
Transformer
TXA/B
TXA/B
RXA/B
RXA/B
BUS A/B
70W
BUS A/B
MIL-STD-1553
Transceiver
1:1.79
HI-1565 / HI-1566
GND
Point
“AT”
Figure 4. Transformer Coupled Test Circuit
HEAT SINK - ESOIC & CHIP-SCALE
PACKAGE
Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a 20-
pin thermally enhanced SOIC package. The HI-1565PCI/T
and HI-1566PCI/T use a plastic chip-scale package. These
packages include a metal heat sink located on the bottom
surface of the device. This heat sink should be soldered
down to the printed circuit board for optimum thermal
dissipation. The heat sink is electrically isolated and may
be soldered to any convenient power or ground plane.
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design notes
regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
THERMAL CHARACTERISTICS
PART NUMBER
HI-1565PSI / T / M
HI-1566PSI / T / M
HI-1565CDI / T / M
HI-1566CDI / T / M
HI-1565PCI / T
HI-1566PCI / T
PACKAGE STYLE
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
20-pin Ceramic
side-brazed DIP
44-pin Plastic chip-
scale package
CONDITION
Heat sink
unsoldered
Heat sink
soldered
Socketed
Heat sink
unsoldered
Ø
JA
54°C/W
47°C/W
62°C/W
49°C/W
JUNCTION TEMPERATURE
T
A
=25°C T
A
=85°C T
A
=125°C
62°C
57°C
69°C
59°C
122°C
117°C
129°C
119°C
162°C
157°C
169°C
159°C
Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.
HOLT INTEGRATED CIRCUITS
6
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
