HT8970
Pad Assignment
1
4
1
3
1
2
1
1
1
0
1
5
1
6
1
D
D
G
N
(
0
,
0
)
2
O
O
S
C
_
3
4
V
C
O
5
6
8
9
7
C
C
1
Chip size: 1790 ´ 2215 (mm)2
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pad Coordinates
Unit: mm
Pad No.
X
Y
Pad No.
X
Y
1
2
3
4
5
6
7
8
701.70
9
652.85
720.20
571.80
423.40
275.00
-77.60
-306.55
-560.95
-698.00
-669.25
-669.25
-669.25
-405.55
-140.05
123.65
389.15
-945.30
882.55
882.55
882.55
882.55
877.60
849.95
737.70
10
11
12
13
14
15
16
-614.45
-762.85
-945.30
-945.30
-945.30
-945.30
-945.30
3
March 14, 2000
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
