PATENTED
Pad Assignment
HT1626
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
D A T A
7 9
V S S
8 0
C S
R D
W R
7 8
7 7
7 6
4 7
7 5
4 6
7 4
4 5
7 3
4 4
7 2
4 3
7 1 7 0
4 2
4 1
6 9 6 8
4 0
3 9
6 7
3 8
6 6 6 5
3 7
3 6
6 4
3 5
6 3
3 4
6 2
3 3
6 1 6 0
3 2
3 1
5 9
3 0
5 8
2 9
5 7
2 8
5 6
2 7
5 5 5 4
2 6
2 5
5 3
2 4
5 2
O S C I
O S C O
2
1
V D D
3
V L C D
4
5
6
IR Q
B Z
B Z
7
(0 , 0 )
8
9
T 1
T 2
T 3
T 4
C O M 0
C O M 1
C O M 2
C O M 3
C O M 4
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1 2 2 2 3
2 4
2 5
2 6
2 7
2 8
2 9
3 0
3 1 3 2
3 3
3 4
3 5
3 6
3 7
3 8
3 9
4 0
4 1
4 2
4 3
4 4 4 5
4 6
4 7
4 8
4 9 5 0
5 1
C O M 5
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
S E G
C O M
C O M
C O M
C O M
C O M
C O M
C O M
C O M
C O M
C O M
0
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
6
7
* The IC substrate should be connected to VDD in the PCB layout artwork.
8
9
1 0
1 1
1 2
1 3
1 4
1 5
Chip size: 148
´
123 (mil)
2
Rev. 1.60
3
November 9, 2010
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
