HT1621
4
8
4
7
4
6
4
5
4
4
4
3
4
2
4
1
4
0
3
9
3
8
3
7
1
3
3
3
3
6
5
4
3
C
S
S
S
S
S
S
S
S
S
S
S
S
S
E
E
E
E
E
E
E
G
E
E
E
E
G
G
G
G
G
G
G
1
1
1
1
1
1
1
1
2
2
2
2
2
3
4
5
6
7
8
9
0
1
2
3
R
D
R
2
3
4
5
6
7
8
9
1
1
1
W
D
A
T
A
S
V
S
3
3
2
1
O
S
C
O
H
T
1
6
2
1
B
O
S
C
I
3
2
2
2
2
2
0
9
8
7
6
5
4
8
L
Q
F
P
-
A
V
L
C
D
D
E
V
D
G
G
G
G
I
R
Q
0
1
2
B
Z
B
Z
1
3
1
4
1
5
1
6
1
7
1
8
1
9
2
0
2
1
2
2
2
3
2
4
Pad Assignment
4
4
4
1
1
4
8
4
7
4
6
4
5
4
3
4
2
4
0
3
9
3
8
3
7
3
6
3
5
3
4
3
3
2
R
D
3
2
S
S
E
E
G
G
1
1
6
7
3
W
R
3
1
3
2
2
0
9
8
S
S
S
S
E
E
E
E
G
G
G
G
1
1
2
2
8
9
0
1
D
A
T
A
4
(
0
,
0
)
V
S
S
5
6
O
S
C
O
2
2
7
6
S
E
G
2
2
2
2
5
4
S
S
E
E
G
G
2
2
3
4
O
S
C
I
7
8
2
3
S
S
E
E
G
G
2
2
5
6
V
L
C
D
D
2
2
2
1
9
V
D
S
E
G
2
7
2
0
S
E
G
2
8
1
0
1
2
1
3
1
1
1
4
1
5
1
6
1
7
1
8
1
9
Chip size: 127 ´ 131 (mil)2
Bump height: 18mm ± 3mm
Min. Bump spacing: 72.36mm
Bump size: 96.042 ´ 96.042mm2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Rev. 1.30
3
August 6, 2003
HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
