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MD82C55B 参数 Datasheet PDF下载

MD82C55B图片预览
型号: MD82C55B
PDF下载: 下载PDF文件 查看货源
内容描述: CMOS可编程外设接口 [CMOS Programmable Peripheral Interface]
分类和应用:
文件页数/大小: 26 页 / 236 K
品牌: HARRIS [ HARRIS CORPORATION ]
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82C55A  
Plastic Leaded Chip Carrier Packages (PLCC)  
0.042 (1.07)  
0.042 (1.07)  
N44.65 (JEDEC MS-018AC ISSUE A)  
0.048 (1.22)  
0.004 (0.10)  
C
44 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE  
0.056 (1.42)  
PIN (1) IDENTIFIER  
0.025 (0.64)  
0.045 (1.14)  
0.050 (1.27) TP  
INCHES  
MILLIMETERS  
R
SYM-  
BOL  
C
L
MIN  
MAX  
MIN  
4.20  
MAX  
4.57  
NOTES  
A
A1  
D
0.165  
0.090  
0.685  
0.650  
0.291  
0.685  
0.650  
0.291  
0.180  
0.120  
0.695  
0.656  
0.319  
0.695  
0.656  
0.319  
-
2.29  
3.04  
-
-
D2/E2  
D2/E2  
17.40  
16.51  
7.40  
17.65  
16.66  
8.10  
C
L
D1  
D2  
E
3
E1 E  
4, 5  
-
17.40  
16.51  
7.40  
17.65  
16.66  
8.10  
VIEW “A”  
E1  
E2  
N
3
4, 5  
6
0.020 (0.51)  
MIN  
44  
44  
A1  
D1  
D
Rev. 2 11/97  
A
SEATING  
PLANE  
0.020 (0.51) MAX  
3 PLCS  
-C-  
0.026 (0.66)  
0.032 (0.81)  
0.013 (0.33)  
0.021 (0.53)  
0.025 (0.64)  
MIN  
0.045 (1.14)  
MIN  
VIEW “A” TYP.  
NOTES:  
1. Controlling dimension: INCH. Converted millimeter dimensions  
are not necessarily exact.  
2. Dimensions and tolerancing per ANSI Y14.5M-1982.  
3. Dimensions D1 and E1 do not include mold protrusions. Allow-  
able mold protrusion is 0.010 inch (0.25mm) per side. Dimen-  
sions D1 and E1 include mold mismatch and are measured at  
the extreme material condition at the body parting line.  
-C-  
4. To be measured at seating plane  
contact point.  
5. Centerline to be determined where center leads exit plastic body.  
6. “N” is the number of terminal positions.  
24  
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