GS4576C09/18/36L
TAP DC Electrical Characteristics and Operating Conditions
Description
Condition
Symbol
Min
+ 0.15
Max
+ 0.3
Units
Notes
1, 2
V
V
V
Input High (logic 1) Voltage
Input High (logic 0) Voltage
—
—
V
V
IH
REF
DD
V
V
– 0.3
V
– 0.15
REF
1, 2
IL
SS
Output disabled,
I
Input Leakage Current
–5.0
5.0
—
LI
0 VV V
IN
DDQ
0 VV V
I
Output Leakage Current
Output Low Voltage
Output Low Voltage
Output High Voltage
Output High Voltage
–5.0
—
5.0
0.2
0.4
—
V
—
1
IN
DD
LO
I
= 100
V
V
V
1
2
1
OLC
OL
OL
I
= 2mA
—
V
1
OLT
I
= 100
V
– 0.2
V
1
OHC
OH
OH
DDQ
DDQ
I = 2mA
V
2
V
– 0.4
—
V
1
OHT
Notes:
1. All voltages referenced to V (GND).
SS
2. Overshoot = V
V + 0.7 V for t tTHTH/2; undershoot = V
– 0.5 V for t tTHTH/2; during normal operation, V must
DDQ
IH(AC)
DD
IL(AC)
not exceed V
DD.
Scan Register Sizes
Register Name
Bit Size
Instruction
Bypass
8
1
ID
32
113
Boundary Scan
JTAG TAP Instruction Codes
Instruction
Code
Description
Captures I/O ring contents; Places the Boundary Scan Register between TDI and TDO. Data
driven by output balls are determined from values held in the Boundary Scan Register.
EXTEST
0000 0000
Loads the ID register with the vendor ID code and places the register between TDI and TDO. This
operation does not affect LLDRAM II operations.
IDCODE
SAMPLE/PRELOAD
CLAMP
0010 0001
0000 0101
0000 0111
0000 0011
1111 1111
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. This
operation does not affect LLDRAM II operations.
Selects the bypass register to be connected between TDI and TDO. Data driven by output balls are
determined from values held in the Boundary Scan Register.
Selects the bypass register to be connected between TDI and TDO. All outputs are forced into
High-Z.
HIGH-Z
Places Bypass Register between TDI and TDO.This operation does not affect LLDRAM II
operations.
BYPASS
Rev: 1.04 11/2013
57/62
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GSI [ GSI TECHNOLOGY ]
