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GS4576C18GL-33T 参数 Datasheet PDF下载

GS4576C18GL-33T图片预览
型号: GS4576C18GL-33T
PDF下载: 下载PDF文件 查看货源
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分类和应用:
文件页数/大小: 62 页 / 2381 K
品牌: GSI [ GSI TECHNOLOGY ]
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GS4576C09/18/36L  
Ball Descriptions  
Symbol  
Type  
Description  
Address Inputs—A0–A21 define the row and column addresses for Read and Write Operations. During  
a Mode Register Set (MRS), the address inputs define the register settings. They are sampled at the  
rising edge of CK.  
A0–A21  
Input  
BA0–B2  
CK, CK  
Input  
Input  
Bank Address inputs—Select to which internal bank a command is being applied.  
Input Clock—CK and CK are differential input clocks. Addresses and commands are latched on the  
rising edge of CK. CK is ideally 180º out of phase with CK.  
Chip Select—CS enables the command decoder when Low and disables it when High. When the  
Input  
Input  
CS  
command decoder is disabled, new commands are ignored, but internal operations continue.  
Data Input—The DQ signals form the 36-bit data bus. During Read commands, the data is referenced to  
DQ0–DQ35  
both edges of QKx. During Write commands, the data is sampled at both edges of DK.  
Input Data Clock—DK and DK are the differential input data clocks. All input data is referenced to both  
edges of DK. DK is ideally 180º out of phase with DK. For the x36 device, DQ0– DQ17 are referenced to  
DK0 and DK0 and DQ18–DQ35 are referenced to DK1 and DK1. For the x9 and x18 devices, all DQs  
are referenced to DK and DK. All DKx and DKx pins must always be supplied to the device.  
Input  
Input  
DK, DK  
DM  
Input Data Mask—The DM signal is the input mask signal for Write data. Input data is masked when DM  
is sampled High. DM is sampled on both edges of DK (DK1 for the x36 configuration). Tie signal to  
ground if not used.  
IEEE 1149.1 clock input—This ball must be tied to V if the JTAG function is not used.  
TCK  
Input  
Input  
SS  
IEEE 1149.1 test inputs—These balls may be left as no connects if the JTAG function is not used.  
TMS, TDI  
Command Inputs—Sampled at the positive edge of CK, WE and REF define (together with CS) the  
Input  
Input  
WE, REF  
command to be executed.  
Input Reference Voltage—Nominally V /2. Provides a reference voltage for the input buffers.  
V
DDQ  
REF  
External Impedance (25–60)—This signal is used to tune the device outputs to the system data bus  
impedance. DQ output impedance is set to 0.2 * RQ, where RQ is a resistor from this signal to ground.  
Connecting ZQ to GND invokes the Minimum Impedance mode. Connecting ZQ to V invokes the  
I/O  
ZQ  
DD  
Maximum Impedance mode. Refer to the Mode Register Definition diagrams (Mode Register Bit 8 (M8))  
to activate or deactivate this function.  
Output Data Clocks—QKx and QKx are opposite polarity, output data clocks. They are free running,  
and during Reads, are edge-aligned with data output from the LLDRAM II. QKx is ideally 180º out of  
phase with QKx. For the x36 device, QK0 and QK0 are aligned with DQ0–DQ17, and QK1 and QK1 are  
aligned with DQ18–DQ35. For the x18 device, QK0 and QK0 are aligned with DQ0–DQ8, while QK1 and  
QK1 are aligned with Q9–Q17. For the x9 device, all DQs are aligned with QK0 and QK0.  
Output  
QKx, QKx  
Rev: 1.04 11/2013  
5/62  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
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