Global Mixed-mode Technology Inc.
G1426
D
L
D1
E1
E
E2
Note 5
A2
A
A1
e
y
b
TSSOP-20L (FD) Package
NOTE:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance 0.1mm unless otherwise specified
3. Coplanarity : 0.1mm
4. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Follow JEDEC MO-153
DIMENSION IN MM
DIMENSION IN INCH
SYMBOL
MIN.
0.80
0.00
0.80
0.19
0.09
6.40
-----
4.30
-----
0.45
-----
0°
NOM.
-----
MAX.
1.15
0.10
1.05
0.30
0.20
6.60
-----
MIN.
0.031
0.000
0.031
0.007
0.004
0.252
-----
NOM.
-----
MAX.
0.045
0.004
0.041
0.012
0.008
0.260
-----
A
A1
A2
b
-----
-----
1.00
-----
0.039
-----
C
-----
-----
D
6.50
6.40
4.40
0.65
0.60
-----
0.256
0.252
0.173
0.026
0.024
-----
E
E1
e
4.50
-----
0.169
-----
0.177
-----
L
y
0.75
0.10
8°
4.28
2.78
0.018
-----
0.030
0.004
8°
0.168
0.109
-----
-----
θ
D1
E2
0°
3.90
2.30
-----
0.153
0.091
-----
-----
-----
Taping Specification
Feed Direction
Typical TSSOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.0
Dec 04, 2003
13
GMT [ GLOBAL MIXED-MODE TECHNOLOGY INC ]
