3.3V Uniform Sector
Dual and Quad Serial Flash
GD25Q80C
10.6. Package USON8 (4*4mm, thickness 0.45mm)
bb
b
ccc
C
C
C
B
E
SEATING PLANE
A
D
M
1
PIN 1 CORNER
A1M
A2
aaa
C
A3
A
Top View
J
Side View
PIN 1 I.D CO.3
8
1
e / 2
e
K
5
4
8Xb
8XL
EXPDSED DIE
ATTACH PAD
Bottom View
VIEW M-M
Dimensions
Symbol
Unit
A
A1
A2
A3
b
D
E
e
J
K
L
Min
0.40
0.00
- - -
0.25
0.25
3.90
3.90
2.20
2.30
2.40
2.90
3.00
3.10
0.35
mm
Nom
Max
Min
0.45
0.30
0.30
4.00
4.00
0.40
0.15
REF
0.8
0.50
0.05
0.000
- - -
0.35
0.35
4.10
4.10
0.45
BSC
0.015
0.017
0.019
0.009
0.011
0.013
0.009
0.011
0.013
0.153
0.157
0.161
0.153
0.157
0.161
0.086 0.114
0.090 0.118
0.094 0.122
0.013
0.015
0.017
Inch
Nom
Max
0.001
Note:
1. Both package length and width do not include mold flash.
2. The exposed metal pad area on the bottom of the package is connected to device ground (GND pin),
so both Floating and connecting GND of exposed pad are also available.
54