3.3V Uniform Sector
Dual and Quad Serial Flash
GD25Q80C
10.4. Package USON8 (3*2mm, thickness 0.45mm)
ccc
C
bb
b
C
SEATING PLANE
M
D
1
PIN 1 CORNER
E
2X
aaa
C
A1M
A3
2X
aaa
C
Top View
A2
A
Side View
L
b
1
8
PIN 1 CORNER
CO.1
e / 2
E1
e
5
4
L1
D1
EXPDSED DIE
ATTACH PAD
B
Bottom View
VIEW M-M
Dimensions
Symbol
Unit
A
A1
A2
0.25
A3
b
D
E
e
D1
E1
L
L1
- - -
Min
0.40
0.00
- - -
0.20
0.25
0.30
2.90
3.00
3.10
1.90
2.00
2.10
0.15
0.20
0.25
1.55
1.60
1.65
0.30
0.35
0.40
0.150
REF
0.5
mm Nom 0.45
Max 0.50
0.30
0.35
0.10
- - -
BSC
0.05
Min 0.015 0.00
0.009 0.005 0.007
0.114 0.074 0.019 0.005 0.061 0.011 - - -
REF
BSC
Inch Nom 0.018 - - -
0.012
0.010
0.012
0.118 0.079
0.122 0.082
0.008 0.063 0.013 0.000
0.009 0.064 0.015 - - -
Max 0.019 0.001 0.013
Note:
1. Both package length and width do not include mold flash.
2. The exposed metal pad area on the bottom of the package is connected to device ground (GND pin),
so both Floating and connecting GND of exposed pad are also available
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