GS9060 Data Sheet
2.4 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. The recommended standard
eutectic reflow profile is shown in Figure 2-1. MSL qualification was performed
using the maximum Pb-free reflow profile shown in Figure 2-2.
60-150 sec.
Temperature
10-20 sec.
230˚C
220˚C
3˚C/sec max
183˚C
6˚C/sec max
150˚C
100˚C
25˚C
Time
120 sec. max
6 min. max
Figure 2-1: Standard Eutectic Solder Reflow Profile
Te mp e ra ture
60-150 s e c .
20-40 s e c .
260˚C
250˚C
3˚C/s e c ma x
217˚C
6˚C/s e c ma x
200˚C
150˚C
25˚C
Time
60-180 s e c . ma x
8 min. ma x
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package)
22208 - 8 January 2007
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GENNUM [ GENNUM CORPORATION ]
