GS1560A/GS1561 Data Sheet
2.4 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. The recommended standard
eutectic reflow profile is shown in Figure 2-1. MSL qualification was performed
using the maximum Pb-free reflow profile shown in Figure 2-2.
60-150 sec.
Temperature
10-20 sec.
230˚C
220˚C
3˚C/sec max
183˚C
6˚C/sec max
150˚C
100˚C
25˚C
Time
120 sec. max
6 min. max
Figure 2-1: Standard Eutectic Solder Reflow Profile
Temperature
60-150 sec.
20-40 sec.
260˚C
250˚C
3˚C/sec max
217˚C
6˚C/sec max
200˚C
150˚C
25˚C
Time
60-180 sec. max
8 min. max
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package)
27360 - 8 September 2005
24 of 80
GENNUM [ GENNUM CORPORATION ]
