MB85RC64
■ PACKAGE DIMENSION
8-pin plastic SOP
Lead pitch
1.27 mm
3.9 mm × 5.05 mm
Gullwing
Package width
package length
×
Lead shape
Sealing method
Mounting height
Weight
Plastic mold
1.75 mm MAX
0.06 g
(FPT-8P-M02)
8-pin plastic SOP
(FPT-8P-M02)
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
+0.25
1 5.05 –0.20 .199 +–..000180
0.22 +–00..0073
.009 +–..000031
*
8
5
*2 3.90 0.30 6.00 0.40
(.154 .012) (.236 .016)
Details of "A" part
45°
1.55 0.20
(Mounting height)
(.061 .008)
0.25(.010)
0.40(.016)
0~8°
"A"
1
4
1.27(.050)
0.44 0.08
(.017 .003)
M
0.13(.005)
0.50 0.20
(.020 .008)
0.15 0.10
(.006 .004)
(Stand off)
0.60 0.15
(.024 .006)
0.10(.004)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
C
2002-2010 FUJITSU SEMICONDUCTOR LIMITED F08004S-c-4-9
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
16
DS05–13109–3E
FUJITSU [ FUJITSU ]
