D A T A S H E E T
amd corresponding reference in Automatic Sleep Mode
REVISION SUMMARY
Revision A (April 1998)
section.
Requirements for Reading Array Data
Split the Am29LV001B/Am29LV010B data sheet into
separate documents. The Am29LV001B data sheet
retains publication number 21557B and later; the
Am29LV010B data sheet has been reassigned publica-
tion number 22140.
Deleted reference to hardware reset. This device does
not have the RESET# pin.
Revision D (December 2, 1999)
AC Characteristics—Figure 12. Program
Operations Timing and Figure 13. Chip/Sector
Erase Operations
Valid Combinations
Changes since publication number 21557A was
released: deleted the “R” designation from the 55 ns
option. Corrected the part numbers.
Deleted t
high.
and changed OE# waveform to start at
GHWL
Revision B (September 1998)
Physical Dimensions
Expanded data sheet from Advanced Information to
Preliminary version.
Replaced figures with more detailed illustrations.
Revision D+1 (November 13, 2000)
Added table of contents. Deleted burn-in option from
Ordering Information section.
Distinctive Characteristics
Changed “Manufactured on 0.35 µm process technology”
to “Manufactured on 0.32 µm process technology”.
Revision D+2 (June 11, 2004)
Ordering Information
Revision C (January 1999)
Data Retention
Added Pb-free OPNs.
Added new table.
Revision D+3 (June 16, 2005)
Removed -45 ns Speed Option
Revision C+1 (March 22, 1999)
Product Selector Guide
Added Colophon and update Trademark
The parameter t should be 25 ns for the -45R device
CE
and 30 ns for the -70 device.
Revision D+4 (August 19, 2005)
Revision Summary
Added Pb-free for PDIP or PLCC package
Deleted draft revision items.
Revision D+5 (January 4, 2006)
Revision C+2 (October 5, 1999)
Removed 32-pin Reverse Pinout TSOP option.
DC Characteristics
Revision D6 (October 11, 2006)
Global
CMOS Compatible table: Deleted I
rent. This device does not have the RESET# pin.
, V Reset Cur-
CC4 CC
Added notice on product availability to cover page and
first page of data sheet.
Changed I
, Automatic Sleep Mode Current, to I
,
CC5
CC4
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable ( i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-
vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-
sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 1998-2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are
trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
36
Am29LV010B
22140D6 October 11, 2006
FUJITSU [ FUJITSU ]
