Datasheet
Vinculum-II Embedded Dual USB Host Controller IC
Version 1.7
Document No.: FT_000138 Clearance No.: FTDI#143
Pb Free Solder Process
SnPb Eutectic and Pb free (non
Profile Feature
green material) Solder Process
(green material)
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat:
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
100°C
150°C
60 to 120 seconds
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
217°C
183°C
60 to 150 seconds
60 to 150 seconds
Peak Temperature (Tp)
260°C
see Table 11.2
Time within 5°C of actual Peak
Temperature (tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
Time for T= 25°C to Peak Temperature, Tp
Table 11.1 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
235 +5/-0 °C
Volume mm3 >=350
220 +5/-0 °C
< 2.5 mm
220 +5/-0 °C
220 +5/-0 °C
≥ 2.5 mm
Pb Free (green material) = 260 +5/-0 °C
Table 11.2 Package Reflow Peak Temperature
81
Copyright © Future Technology Devices International Limited
FTDI [ FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. ]
