FT240X USB 8-BIT FIFO IC Datasheet
Version 1.3
Document No.: FT_000626 Clearance No.: FTDI# 259
9.5 Solder Reflow Profile
The FT240X is supplied in Pb free 24 LD SSOP and QFN-24 packages. The recommended solder reflow
profile for both package options is shown in 9.5.
tp
T
p
Critical Zone: when
T is in the range
Ramp Up
T to T
p
L
T
L
tL
T Max
S
Ramp
Down
T Min
S
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 9.5 FT240X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT240X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT240X is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
100°C
150°C
60 to 120 seconds
150°C
200°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
- Time (tL)
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak
Temperature (tp)
20 to 40 seconds
6°C / second Max.
8 minutes Max.
20 to 40 seconds
6°C / second Max.
6 minutes Max.
Ramp Down Rate
Time for T= 25°C to Peak Temperature,
Tp
Table 9.1 Reflow Profile Parameter Values
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