Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.1
Clearance No.: FTDI# 318
8.4 Solder Reflow Profile
The FT313H is supplied in Pb free QFN-64, LQFP-64 and TQFP-64 packages. The recommended solder
reflow profile for all package options is shown in Figure 8-4.
tp
T
p
Critical Zone: when
T is in the range
Ramp Up
T to T
p
L
T
L
tL
T Max
S
Ramp
Down
T Min
S
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 8-4 FT313H Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 8-1. Values are shown for
both a completely Pb free solder process (i.e. the FT313H is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT313H is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
100°C
150°C
150°C
200°C
60 to 120 seconds
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
217°C
183°C
- Temperature (TL)
- Time (tL)
60 to 150 seconds
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak Temperature
(tp)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
Time for T= 25°C to Peak Temperature, Tp
Table 8-1 Reflow Profile Parameter Values
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