PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
R
POSITIVE PRESSURE
(P1)
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
B
-A-
INCHES
DIM MIN MAX MIN
MILLIMETERS
N
L
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
PIN 1
1
2
3
4
5
6
0.514
0.200
0.027
0.048
SEATING
PLANE
-T-
0.220
0.033
0.064
5.08
0.68
1.22
0.84
1.63
G
J
S
G
J
L
M
N
R
S
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
D 6 PL
0.136 (0.005)
30˚ NOM
30˚ NOM
M
M
T A
0.475
0.430
0.090
0.495 12.07
0.450 10.92
12.57
11.43
2.66
0.105
2.29
STYLE 1:
PIN 1. VOUT
2. GROUND
STYLE 2:
PIN 1. OPEN
2. GROUND
STYLE 3:
PIN 1. OPEN
2. GROUND
3. VCC
4. V1
5. V2
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. VEX
6. OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
P
0.25 (0.010)
-A-
U
W
M
M
T Q
INCHES
DIM MIN MAX
MILLIMETERS
MIN
29.08
17.40
10.29
0.68
MAX
29.85
18.16
11.05
0.84
X
A
B
C
D
F
1.145
0.685
0.405
0.027
0.048
1.175
0.715
0.435
0.033
0.064
L
V
R
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2 VACUUM (P2)
1.22
1.63
PORT #1 POSITIVE
PRESSURE (P1)
G
J
K
L
N
P
Q
R
S
U
V
W
X
0.100 BSC
2.54 BSC
N
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
0.36
17.65
7.37
10.67
3.89
3.89
1.60
5.59
0.41
18.42
7.62
11.18
4.04
4.04
2.11
6.10
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
0.910 BSC
23.11 BSC
K
1
2
3
4
5
6
0.182
0.310
0.248
0.194
0.330
0.278
4.62
7.87
6.30
4.93
8.38
7.06
C
S
SEATING
PLANE
SEATING
PLANE
-T-
-T-
6 PL
D
STYLE 1:
PIN 1. VOUT
2. GROUND
G
J
M
M
0.13 (0.005)
A
F
3. VCC
4. V1
5. V2
6. VEX
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
MPX5700
Sensors
Freescale Semiconductor
5