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MPX5700AP 参数 Datasheet PDF下载

MPX5700AP图片预览
型号: MPX5700AP
PDF下载: 下载PDF文件 查看货源
内容描述: 集成硅压力传感器片上信号调节,温度补偿和校准 [Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated]
分类和应用: 传感器压力传感器温度补偿
文件页数/大小: 9 页 / 250 K
品牌: FREESCALE [ Freescale ]
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ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING  
Figure 3 illustrates both the Differential/Gauge and the  
Absolute Sensing Chip in the basic chip carrier (Case 867).  
A fluorosilicone gel isolates the die surface and wire bonds  
from the environment, while allowing the pressure signal to  
be transmitted to the sensor diaphragm. (For use of the  
MPX5700D in a high-pressure cyclic application, consult the  
factory.)  
The MPX5700 series pressure sensor operating  
characteristics, and internal reliability and qualification tests  
are based on use of dry air as the pressure media. Media,  
other than dry air, may have adverse effects on sensor  
performance and long-term reliability. Contact the factory for  
information regarding media compatibility in your application.  
Figure 2 shows the sensor output signal relative to  
pressure input. Typical, minimum, and maximum output  
curves are shown for operation over a temperature range of  
0° to 85°C using the decoupling circuit shown in Figure 4. The  
output will saturate outside of the specified pressure range.  
Figure 4 shows the recommended decoupling circuit for  
interfacing the output of the integrated sensor to the A/D input  
of a microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
5.0  
Transfer Function:  
4.5  
V
V
out = VS*(0.0012858*P+0.04) ± Error  
S = 5.0 Vdc  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
Temperature = 0 to 85°C  
Typical  
Maximum  
Minimum  
200  
400  
500  
600  
700  
800  
0
100  
300  
Differential Pressure (kPa)  
Figure 2. Output versus Pressure Differential  
Fluoro Silicone  
Die Coat  
Fluoro Silicone  
Stainless Steel  
Metal Cover  
Stainless Steel  
Metal Cover  
Die Coat  
Die  
Die  
P1  
P2  
P1  
P2  
Wire Bond  
Wire Bond  
Lead Frame  
Lead Frame  
RTV Die  
Bond  
RTV Die  
Bond  
Epoxy Case  
Epoxy Case  
DIFFERENTIAL/GAUGE ELEMENT  
ABSOLUTE ELEMENT  
Figure 3. Cross-Sectional Diagrams (not to scale)  
+5 V  
Output  
Vout  
Vs  
IPS  
1.0 µF  
GND  
470 pF  
0.01 µF  
Figure 4. Recommended Power Supply Decoupling and Output Filtering  
(For additional output filtering, please refer to Application Note AN1646)  
MPX5700  
Sensors  
Freescale Semiconductor  
3
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