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MPC8572ELVTAULD 参数 Datasheet PDF下载

MPC8572ELVTAULD图片预览
型号: MPC8572ELVTAULD
PDF下载: 下载PDF文件 查看货源
内容描述: MPC8572E的PowerQUICC III集成处理器硬件规格 [MPC8572E PowerQUICC III Integrated Processor Hardware Specifications]
分类和应用: PC
文件页数/大小: 140 页 / 1412 K
品牌: FREESCALE [ Freescale ]
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Document Revision History  
Table 87 explains line four of Figure 67.  
Table 87. Meaning of Last Line of Part Marking  
Digit  
Description  
A
Assembly Site  
E Oak Hill  
Q KLM  
WL  
YY  
Lot number  
Year assembled  
WW  
Work week assembled  
23 Document Revision History  
Table 88 provides a revision history for the MPC8572E hardware specification.  
Table 88. Document Revision History  
Rev.  
Number  
Date  
Substantive Change(s)  
4
06/2010  
• In Section 18.3, “Pinout Listings,updated Table 75 showing GPINOUT power rail as BVDD.  
• Updated Section 14.1, “GPIO DC Electrical Characteristics.”  
3
2
03/2010  
06/2009  
• In Section 2.1, “Overall DC Electrical Characteristics,changed GPIO power from OVDD to BVDD.  
• In Section 22.1, “Part Numbers Fully Addressed by this Document,added Table 85 for Rev 2.1  
silicon.  
• In Section 22.1, “Part Numbers Fully Addressed by this Document,updated Table 86 for Rev 1.1.1  
silicon.  
• In Section 3, “Power Characteristics,updated CCB Max to 533MHz for 1200MHz core device in  
Table 4, “MPC8572E Power Dissipation.”  
• In Section 4.4, “DDR Clock Timing,changed DDRCLK Max to 100MHz. This change was  
announced in Product Bulletin #13572.  
• Clarified restrictions in Section 4.5, “Platform to eTSEC FIFO Restrictions.”  
• In Table 8, “RESET Initialization Timing Specifications,added note 2.  
• Added Section 14, “GPIO.”  
• In Section 18.1, “Package Parameters for the MPC8572E FC-PBGA,updated material composition  
to 63% Sn, 37% Pb.  
• In Section 18.2, “Mechanical Dimensions of the MPC8572E FC-PBGA, updated Figure 61 to  
correct the package thickness and top view.  
• In Section 19.1, “Clock Ranges,updated CCB Max to 533MHz for 1200MHz core device in  
Table 76, “MPC8572E Processor Core Clocking Specifications.”  
• In Section 19.5.2, “Minimum Platform Frequency Requirements for High-Speed Interfaces,”  
changed minimum CCB clock frequency for proper PCI Express operation.  
• Added LPBSE to description of LGPL4/LGTA/LUPWAIT/LPBSE/LFRB signal in Table 75,  
“MPC8572E Pinout Listing.”  
• Corrected supply voltage for GPIO pins in Table 75, “MPC8572E Pinout Listing.”  
• Applied note to SD1_PLL_TPA in Table 75, “MPC8572E Pinout Listing.”  
• Updated note regarding MDIC in Table 75, “MPC8572E Pinout Listing.”  
• Added note for LAD pins in Table 75, “MPC8572E Pinout Listing.”  
• Updated Table 86, “,Part Numbering Nomenclature - Rev 1.1.1” with Rev 2.0 and Rev 2.1 part  
number information. Added note indicating that silicon version 2.0 is available for prototype  
purposes only and will not be available as a qualified device.  
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4  
Freescale Semiconductor  
137  
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