Package and Pin Listings
Figure 66 shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package.
Figure 66. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II
Note:
1
All dimensions are in millimeters.
2
Dimensioning and tolerancing per ASME Y14. 5M-1994.
3
Maximum solder ball diameter measured parallel to Datum A.
4
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5
Parallelism measurement should exclude any effect of mark on top surface of package.
21.2 Pinout Listings
Table 67 provides the pin-out listing for the TePBGA II package.
Table 67. TePBGA II Pinout Listing
Signal
Package Pin Number
Pin Type
Power Supply
Notes
Clock Signals
CLKIN
K24
I
OVDD
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MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
89
FREESCALE [ Freescale ]
