Pressure
On-chip Temperature Compensation and Calibration
Figure 3
illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 482A). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MP3V5050 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
3
Transfer Function:
V
out
= V
S
*(0.018*P+0.04) ± ERROR
V
S
= 3.0 Vdc
TEMP = 0 to 85°C
TYPICAL
MAX
1
MIN
shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
Figure 4.
The
output will saturate outside of the specified pressure range.
Figure 4
shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
2
Output (V)
0
0
5
10
15
20
25
30
35
40
45
50
55
Differential Pressure (kPa)
Figure 2. Output vs. Pressure Differential
FLUOROSILICONE
GEL DIE COAT
P1
WIRE BOND
LEAD
FRAME
DIFFERENTIAL
SENSING ELEMENT
P2
DIE BOND
THERMOPLASTIC
CASE
DIE
STAINLESS
STEEL CAP
Figure 3. Cross-Sectional Diagram SOP (not to scale)
3V
V
out
V
s
IPS
1.0
μF
0.01
μF
GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MP3V5050
4
Sensors
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
