Peripheral operating requirements and behaviors
6.3.3.2 32kHz oscillator frequency specifications
Table 17. 32kHz oscillator frequency specifications
Symbol Description
Min.
—
Typ.
32.768
1000
Max.
—
Unit
kHz
ms
Notes
fosc_lo
tstart
Oscillator crystal
Crystal start-up time
—
—
1
1. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 18. NVM program/erase timing specifications
Symbol Description
thvpgm4 Longword Program high-voltage time
thversscr Sector Erase high-voltage time
Min.
Typ.
Max.
Unit
Notes
—
7.5
18
μs
—
—
—
13
52
113
452
904
ms
ms
ms
1
1
1
thversblk32k Erase Block high-voltage time for 32 KB
thversblk256k Erase Block high-voltage time for 256 KB
104
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
Table 19. Flash command timing specifications
Symbol Description
Read 1s Block execution time
Min.
Typ.
Max.
Unit
Notes
trd1blk32k
• 32 KB data flash
—
—
—
—
0.5
1.7
ms
ms
• 256 KB program flash
trd1blk256k
trd1sec1k
Read 1s Section execution time (data flash
sector)
—
—
—
—
60
60
μs
μs
1
1
trd1sec2k
Read 1s Section execution time (program flash
sector)
Table continues on the next page...
K51 Sub-Family Data Sheet, Rev. 2, 4/2012.
32
Freescale Semiconductor, Inc.
FREESCALE [ Freescale ]
