Ordering Information and Mechanical Specifications
56-Pin Shrink Dual In-Line Package (SDIP)
20.4 56-Pin Shrink Dual In-Line Package (SDIP)
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
56
29
28
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
–B–
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
51.69
13.72
3.94
MAX
52.45
14.22
5.08
A
B
C
D
E
F
2.035
0.540
0.155
0.014
2.065
0.560
0.200
0.022
L
0.36
0.56
H
C
0.035 BSC
0.89 BSC
0.032
0.046
0.81
1.17
G
H
J
K
L
0.070 BSC
0.300 BSC
1.778 BSC
7.62 BSC
–T–
SEATING
PLANE
K
0.008
0.115
0.015
0.135
0.20
2.92
0.38
3.43
0.600 BSC
15.24 BSC
N
G
M
F
M
N
0
0.020
15
0.040
0
0.51
15
1.02
E
J 56 PL
D 56 PL
0.25 (0.010)
M
S
T A
M
S
T B
0.25 (0.010)
MC68HC908MR32 • MC68HC908MR16 — Rev. 6.0
MOTOROLA Ordering Information and Mechanical Specifications
Data Sheet
303