TQFP Package Mechanical Drawing
3.2 TQFP Package Mechanical Drawing
G
P
4X
4X 52 TIPS
157
0.2 T L-M N
0.2 T L-M N
208
Pin 1
ident
C
L
AB
AB
1
156
X
X= L, M or N
View Y
Plating
F
Base metal
J
M
3X view Y
U
D
B
V
M
0.08 T L-M N
L
Section AB-AB
0
rotated 90 clockwise
208 places
B1
Notes:
1.Dimensioning and tolerancing per ANSI
Y14.5M, 1982.
V1
2.Controlling dimension: millimeter.
3. Datum plane-H- is located at bottom of
lead and is coincident with the lead
52
105
where the lead exits the plastic body at
the bottom of the parting line.
4. Datums -L-, -M-, and -N- to be
104
53
determined at datum plane -H-.
N
5. Dimensions S and V to be determined
at seating place -T-.
A1
S1
6. Dimensions A and B do not include
mold protrusion. Allowable protrusion
is 0.25 per side. Dimensions A and B
do include mold mismatch and are
determined at datum plane -H-.
A
S
7. Dimension d does not include dambar
protrusion. Dambar protrusion shall
not cause the lead width to exceed
0.35 minimum space between
View AA
protrusion and adjacent lead 0.07.
C
Millimeters
DIM MIN
MAX
28.00 BSC
14.00 BSC
Seating
plane
A
A1
B
B1
C
4X (q2)
28.00 BSC
14.00 BSC
208X
0.08 T
T
---
0.05
1.35
0.17
0.45
0.17
1.60
C1
C2
D
---
1.45
0.27
0.75
0.23
0.05
(W)
q1
2X R R1
0.25
E
F
G
J
0.50 BSC
0.09
0.20
C2
K
P
R1
S
S1
U
0.50 REF
0.25 BSC
0.10 0.20
30.00 BSC
15.00 BSC
Gage
plane
(K)
0.09
0.16
q
C1
V
30.00 REF
15.00 REF
0.20 REF
1.00 REF
E
V1
W
Z
(Z)
View AA
q
q1
q2
0
0
7
---
CASE 998-01
12 REF
Figure 3-3. DSP56301 Mechanical Information, 208-pin TQFP Package
DSP56301 Technical Data, Rev. 10
Freescale Semiconductor
3-11
FREESCALE [ Freescale ]
