Packaging
3
This section provides information on the available packages for the DSP56301, including diagrams of the package
pinouts and tables showing how the signals discussed in Section 1 are allocated for each package. The DSP56301
is available in two package types:
•
•
208-pin Thin Quad Flat Pack (TQFP)
252-pin Molded Array Process-Ball Grid Array (MAP-BGA)
Note: Both packages are available in lead-bearing and lead-free versions. Switching a design from a lead-bearing
package device to a lead-free package device may require a change in the board manufacturing process.
The lead-free package requires a higher solder flow temperature than the lead-bearing device. Refer to
Lead-Free BGA Solder Joint Assembly Evaluation (EB635) for manufacturing considerations when
incorporating lead-free package devices into a design.
DSP56301 Technical Data, Rev. 10
Freescale Semiconductor
3-1
FREESCALE [ Freescale ]
