PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents to aid your design process.
Application Notes
•
•
•
•
AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
•
•
•
Electromigration MTTF Calculator
RF High Power Model
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &
Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
1
2
July 2008
Oct. 2008
Mar. 2009
•
•
•
Initial Release of Data Sheet
Added Fig. 13, MTTF versus Junction Temperature, p. 6
Corrected Z , “0.40 + j5.93” to “0.39 + j1.26” and Z
, “1.42 + j5.5” to “1.27 + j0.96” in Fig. 14, Series
load
source
Equivalent Source and Load Impedance data table and replotted data, p. 7
3
Apr. 2010
•
•
Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related
“Continuous use at maximum temperature will affect MTTF” footnote added and changed 200°C to 225°C
in Capable Plastic Package bullet, p. 1
Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software,
p. 14
MRF6V4300NR1 MRF6V4300NBR1
RF Device Data
Freescale Semiconductor
14
FREESCALE [ Freescale ]
