Freescale Semiconductor, Inc.
12.3 PACKAGE DIMENSIONS
12.3.1 FE Suffix
FE SUFFIX PACKAG
CERAMIC QFP
X
CASE 863A-01
PIN ONE INDEN
TOP VIEW
TRIMMED, FORMED DISCRET
SHOWING DATUM FEATUR
Z
R
K
Q
0.50M T X
S
Z S
Y
Y
M
C
J
M
W
∩
0.10144X
T
SEATING PLANE
144X
D
G
H
M
Z S
S
0.20 T X-Y
M
0.20
S
T
Z
X-Y
S/V
S
0.20 T X-Y
Z
SIDE VIEW
0.20S
T
Z
S
X-Y S
GULL WING LEAD CONFIGURA
NOTES:
MILLIMETE
INCHE
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIM A AND B DEFINE MAXIMUM CERAMIC BODY DIMEN
INCLUDING GLASS PROTRUSION AND MISMATCH OF C
BODY TOP AND BOTTOM.
4. DATUM PLANE -W- IS LOCATED AT THE UNDERSIDE O
WHERE LEADS EXIT PACKAGE BODY.
5. DATUMS X-Y AND Z TO BE DETERMINED WHERE CENT
EXIT PACKAGE BODY AT DATUM -W-.
DIM MIN MAX MIN
MAX
1.09
1.09
0.17
0.01
A
25.8
25.8
3.55
0.22
27.7
27.7
4.31 0.14
0.41 0.00
1.01
1.01
B
C
D
G
H
J
K
M
Q
0.65 BS
0.0256 BS
0.25
0.13
0.65
0.88 0.01
0.25 0.00
0.95 0.02
0.03
0.01
0.03
°
0
°
8
°
0
°
8
6. DIM S AND V TO BE DETERMINED AT SEATING PLANE
7. DIM A AND B TO BE DETERMINED AT DATUM PLANE -
0.325 BS
0.0128 BS
12-6
MC68340 USER’S MANUAL
MOTOROLA
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