Freescale Semiconductor, Inc.
Mechanical Specifications
18.3 32-Pin LQFP Package (Case No. 873A)
4X
A
A1
0.20 (0.008) AB T–U Z
32
25
1
–U–
–T–
B
V
AE
AE
P
B1
DETAIL Y
V1
17
8
DETAIL Y
9
4X
–Z–
0.20 (0.008) AC T–U Z
9
NOTES:
S1
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
S
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
DETAIL AD
G
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
–AB–
–AC–
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
SEATING
PLANE
0.10 (0.004) AC
BASE
METAL
N
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
F
D
8X M
MILLIMETERS
DIM MIN MAX
7.000 BSC
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
R
J
A
A1
B
3.500 BSC
7.000 BSC
3.500 BSC
SECTION AE–AE
E
C
B1
C
1.400
1.600 0.055
0.063
0.018
0.057
0.016
D
E
F
0.300
1.350
0.300
0.450 0.012
1.450 0.053
0.400 0.012
W
G
H
J
K
M
N
P
0.800 BSC
0.031 BSC
Q
H
K
X
0.050
0.090
0.500
0.150 0.002
0.200 0.004
0.700 0.020
0.006
0.008
0.028
12 REF
12 REF
0.006
0.016 BSC
DETAIL AD
0.090
0.160 0.004
0.400 BSC
Q
R
1
5
1
5
0.150
0.250 0.006
0.010
S
9.000 BSC
0.354 BSC
S1
V
V1
W
X
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
Advance Information
246
MC68HC908RFRK2
MOTOROLA
Mechanical Specifications
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