General Characteristics
Table 10-2 56F8322/56F8122 ElectroStatic Discharge (ESD) Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
2000
200
—
—
—
—
—
—
V
V
V
ESD for Charge Device Model (CDM)
500
6
Table 10-3 Thermal Characteristics
Value
Characteristic
Comments
Symbol
Unit
Notes
48-pin LQFP
Junction to ambient
Natural Convection
RθJA
41
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
34
34
°C/W
°C/W
2
Junction to ambient
Natural Convection
Four layer board
(2s2p)
RθJMA
(2s2p)
1,2
Junction to ambient (@1m/sec)
Four layer board
(2s2p)
RθJMA
29
°C/W
1,2
Junction to case
RθJC
8
2
°C/W
°C/W
W
3
Junction to center of case
I/O pin power dissipation
Power dissipation
ΨJT
4, 5
P
User-determined
P D = (IDD x VDD + P I/O
I/O
P
)
W
D
(TJ - TA) / RθJA7
Maximum allowed PD
P
W
DMAX
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
mal test board.
2. Junction to ambient thermal resistance, Theta-JA (R
), was simulated to be equivalent to the JEDEC specification JESD51-2
qJA
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (R
), was simulated to be equivalent to the measured values using the cold
qJC
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (Y ), is the "resistance" from junction to reference point thermocouple on top cen-
JT
ter of case as defined in JESD51-2. Y is a useful value to use to estimate junction temperature in steady-state customer envi-
JT
ronments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
6. See Section 12.1 for more details on thermal design considerations.
7. TJ = Junction temperature
TA = Ambient temperature
56F8322 Technical Data, Rev. 16
Freescale Semiconductor
Preliminary
103
FREESCALE [ Freescale ]
