NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
4X
0.200 AB T-U Z
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DETAIL Y
9
A
P
A1
48
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
37
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
1
36
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
AANDBDOINCLUDEMOLDMISMATCHAND
ARE DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION
SHALL NOT CAUSE THE D DIMENSION TO
EXCEED 0.350.
T
U
B
V
AE
AE
B1
V1
12
25
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076.
9. EXACT SHAPE OF EACH CORNER IS
OPTIONAL.
13
24
Z
MILLIMETERS
DIM MIN MAX
S1
A
A1
B
7.000 BSC
3.500 BSC
7.000 BSC
T, U, Z
S
B1
C
D
E
F
G
H
J
K
L
M
N
P
3.500 BSC
DETAIL Y
4X
1.400 1.600
0.170 0.270
1.350 1.450
0.170 0.230
0.500 BSC
0.050 0.150
0.090 0.200
0.500 0.700
0.200 AC T-U
Z
0.080 AC
G
AB
AC
0
7
°
°
12 REF
°
0.090 0.160
0.250 BSC
0.150 0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
R
S
S1
V
V1
W
AA
AD
°
M
BASE METAL
TOP & BOTTOM
R
N
J
E
C
H
F
D
M
0.080
AC T-U Z
SECTION AE-AE
W
°
L
K
DETAIL AD
CASE 932-03
ISSUE F
AA
Figure 4-2 48-pin LQFP Mechanical Information
Please see www.freescale.com for the most current case outline.
56F801 Technical Data, Rev. 17
42
Freescale Semiconductor