DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Variations
Characteristic
Wake Input Clamp Voltage, I
CL(WAKE)
< 2.5 mA
35XS3400C
35XS3400D
Fault Detection Blanking Time
35XS3400C
35XS3400D
Output Shutdown Delay Time
35XS3400C
35XS3400D
Peak Package Reflow Temperature During Reflow
1.
2.
T
PPRT
t
DETECT
-
-
7.0
7.0
30
20
°C
Symbol
V
CL(WAKE)
18
20
25
27
32
35
μs
-
-
5.0
5.0
20
10
μs
Min
Typ
Max
Unit
V
t
FAULT
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
35XS3400
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
