MC33910G5AC/MC3433910G5AC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ESD Capability
AECQ100
V
Human Body Model - JESD22/A114 (C
= 100 pF, R
= 1500 Ω)
ZAP
ZAP
V
V
V
±8.0k
±6.0k
±2000
LIN Pin
L1
ESD1-1
ESD1-2
ESD1-3
all other Pins
Charge Device Model - JESD22/C101 (C
= 4.0 pF)
ZAP
V
V
±750
±500
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
ESD2-1
ESD2-2
According to LIN Conformance Test Specification / LIN EMC Test
Specification, August 2004 (C = 150 pF, R = 330 Ω)
ZAP
ZAP
Contact Discharge, Unpowered
LIN pin with 220 pF
V
V
V
V
±20k
±11k
ESD3-1
ESD3-2
ESD3-3
ESD3-4
LIN pin without capacitor
VS1/VS2 (100 nF to ground)
L1 input (33 kΩ serial resistor)
>±12k
±6000
According to IEC 61000-4-2 (C
= 150 pF, R
= 330 Ω)
ZAP
ZAP
Unpowered
±8000
±8000
±8000
LIN pin with 220 pF and without capacitor
VS1/VS2 (100 nF to ground)
V
V
V
ESD4-1
ESD4-2
ESD4-3
L1 input (33 kΩ serial resistor)
THERMAL RATINGS
Operating Ambient Temperature (8)
T
°C
A
33910
34910
-40 to 125
-40 to 85
Operating Junction Temperature
Storage Temperature
T
-40 to 150
-55 to 150
°C
°C
J
TSTG
RθJA
Thermal Resistance, Junction to Ambient
°C/W
Natural Convection, Single Layer board (1s)(8), (9)
Natural Convection, Four Layer board (2s2p)(8), (10)
85
56
Thermal Resistance, Junction to Case(11)
RθJC
23
°C/W
Peak Package Reflow Temperature During Reflow(12), (13)
TPPRT
Note 13
°C
Notes
8. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
9. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
10. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
11. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
12. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
13. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33910
Analog Integrated Circuit Device Data
Freescale Semiconductor
8
FREESCALE [ Freescale ]
