MC33910BAC / MC34910BAC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 32. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RATINGS
Operating Ambient Temperature(77)
T
°C
A
33910
34910
-40 to 125
-40 to 85
Operating Junction Temperature(77)
Storage Temperature
T
-40 to 150
-55 to 150
°C
°C
J
TSTG
RθJA
Thermal Resistance, Junction to Ambient
°C/W
Natural Convection, Single Layer board (1s)(78), (79)
Natural Convection, Four Layer board (2s2p)(78), (80)
85
56
Thermal Resistance, Junction to Case(81)
Peak Package Reflow Temperature During Reflow(82), (83)
Notes
RθJC
23
°C/W
TPPRT
Note 83
°C
77. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
78. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
79. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
80. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
81. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
82. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
83. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33910
Analog Integrated Circuit Device Data
Freescale Semiconductor
52
FREESCALE [ Freescale ]
