ELECTRICAL CONNECTIONS
MAXIMUM RATINGS
ELECTRICAL CONNECTIONS
MAXIMUM RATINGS
Table 4. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
ELECTRICAL RATINGS
Power Supply Voltage
Steady State
Input Pin Voltage
WAKE Input Pin Clamp Current
Continuous per Output Current
Low-Sides 4, 6, 8, 10
Low-Sides 5, 7, 9, 11
Continuous per Output Current
High-Sides 0, 1
High-Sides 2, 3
Output Clamp Energy
High-Sides 0, 1
Low-Sides
ESD Voltage
Human Body Model
Machine Model
V
ESD1
V
ESD2
± 2000
± 200
Symbol
Value
Unit
V
PWR
-16 to 41
V
IN
I
WICI
I
OUTLS
500
800
I
OUTHS
10
5.0
- 0.3 to 7.0
2.5
V
V
mA
mA
A
mJ
E
HS
E
HS
E
LS
450
120
50
V
High-Sides 2, 3
Notes
1. Exceeding voltage limits on SCLK, SI, CS, WDIN, RST, IHS, FSI, or ILS pins may cause a malfunction or permanent damage to the
device.
2. Continuous low-side output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient
temperature will require calculation of maximum output current using package thermal resistance.
3. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient
temperature will require calculation of maximum output current using package thermal resistance.
4. Active HS0 and HS1 clamp energy using the following conditions: single nonrepetitive pulse, V
PWR
= 16.0 V, L = 40 mH, T
J
= 150°C.
5.
6.
7.
Active HS2 and HS3 clamp energy using the following conditions: single nonrepetitive pulse, V
PWR
= 16.0 V, L = 10 mH, T
J
= 150°C.
Active low-side clamp energy using the following conditions: single nonrepetitive pulse, 450 mA, T
J
= 150°C.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω),
ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
Ω).
33888
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Analog Integrated Circuit Device Data
Freescale Semiconductor