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33874_08 参数 Datasheet PDF下载

33874_08图片预览
型号: 33874_08
PDF下载: 下载PDF文件 查看货源
内容描述: 四通道高边开关 [Quad High Side Switch]
分类和应用: 开关
文件页数/大小: 38 页 / 1963 K
品牌: FREESCALE [ Freescale ]
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ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 2. Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
ELECTRICAL RATINGS  
Operating Voltage Range  
Steady-State  
V
V
PWR(SS)  
VDD  
-16 to 41  
-0.3 to 5.5  
-0.3 to 7.0  
VDD Supply Voltage  
Input/Output Voltage(1)  
SO Output Voltage(1)  
WAKE Input Clamp Current  
CSNS Input Clamp Current  
HS [0:3] Voltage  
V
V
(1)  
See note  
VSO  
-0.3 to V +0.3  
DD  
V
I
2.5  
10  
mA  
mA  
V
CL(WAKE)  
I
CL(CSNS)  
V
HS  
Positive  
41  
-16  
11  
Negative  
Output Current(2)  
I
A
mJ  
V
HS[0:3]  
Output Clamp Energy(3)  
ESD Voltage(4)  
E
85  
CL[0:3]  
Human Body Model (HBM)  
Charge Device Model (CDM)  
Corner Pins (1, 13, 19, 21)  
V
±2000  
ESD  
±750  
±500  
All Other Pins (2-12, 14-18, 20, 22-24)  
THERMAL RATINGS  
Operating Temperature  
Ambient  
°C  
TA  
TJ  
-40 to 125  
-40 to 150  
-55 to 150  
Junction  
Storage Temperature  
Thermal Resistance(5)  
Junction to Case  
TSTG  
°C  
°C/W  
R
θJC  
<1.0  
30  
R
θJA  
Junction to Ambient  
Peak Pin Reflow Temperature During Solder Mounting(6)  
T
Note 6  
°C  
SOLDER  
Notes  
1. Exceeding voltage limits on IN[0:3], RST, FSI, CSNS, TEMP, SI, SO, SCLK, CS, or FS pins may cause a malfunction or permanent  
damage to the device.  
2. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output  
current using package thermal resistance is required.  
3. Active clamp energy using single-pulse method (L = 2mH, R = 0Ω, V  
= 14V, T = 150°C initial).  
J
L
PWR  
4. ESD testing is performed in accordance with the Human Body Model (C  
= 100pF, R  
= 1500Ω), Charge Device Model (CDM),  
ZAP  
ZAP  
Robotic (C  
= 4.0pF).  
ZAP  
5. Device mounted on a 2s2p test board per JEDEC JESD51-2.  
6. Freescale’s Package Reflow capability meets Sn-Pb-free requirements for JEDEC standard J-STD-020A. For Peak Package Reflow  
Temperature and Moisture Sensitivity Levels (MSL),  
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.  
MC33xxxD enter 33xxx), and review parametrics.  
33874  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
5
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