ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to GND unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
ELECTRICAL RATINGS
Supply Voltages
VSUPn
Load Dump VSUPn (300ms maximum - either pin)
VCC
VDD
VPP
Maximum Voltage on Logic Input/Output Pins
Maximum Voltage on DBUS Pins
Maximum DBUS Pin Current
Maximum Logic Pin Current
ESD Voltage
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
Corner pins
All other pins
THERMAL RATINGS
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Shutdown (Bus Drivers and Pseudo Bus Switch)
Resistance, Junction-to-Ambient
Resistance, Junction-to-Board
Soldering Reflow Temperature
Peak Package Reflow Temperature During Reflow
T
STG
T
A
T
J
T
SD
R
θ
JA
R
θ
JB
T
SOLDER
T
PPRT
-55 to 150
-40 to 90
-40 to 150
155 to 190
71
6
260
°C
°C
°C
°C
°C/W
°C/W
°C
°C
±750
±500
V
ESD
±2000
±200
V
SUP1
and
-0.3 to 26.5
40
-0.3 to 7.0
-0.3 to 3.1
-0.3 to 10.0
-0.3 to V
CC
+ 0.3
-0.3 to V
SUPn
+ 0.3
400
20
V
V
mA
mA
V
V
Symbol
Value
Unit
V
SUP2
V
CC
V
DD
V
PP
–
V
DBUS
I
DBUS
I
LOGIC
V
SUPLD
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100pF, R
ZAP
= 1500Ω); ESD2 testing is performed
in accordance with the Machine Model (MM) (C
ZAP
= 200pF, R
ZAP
= 0Ω); and Charge Body Model (CBM).
2.
3.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
