ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
RXD
TXD
VDD
RST
INT
GND
GND
GND
GND
V2
WDOG
CS
2
3
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
L3
4
A
5
6
7
8
9
10
11
12
13
14
V2CTRL
VSUP
HS
L2
L1
L0
33742 Pin Connections
28-Pin SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
Figure 39. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Table 44. Thermal Resistance Performance
Cu traces, 0.07 mm thickness
RθJA [°C/W]
[mm²]
0
300
600
A
68
52
47
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
RθJA is the thermal resistance between die junction and
ambient air.
Ambient Conditions: Natural convection, still air
33742
Analog Integrated Circuit Device Data
Freescale Semiconductor
62
FREESCALE [ Freescale ]
