MAXIMUM RATINGS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
ELECTRICAL RATINGS
Input Power Supply Voltage
I
B
+
= 0.0 A
Terminal Soldering Temperature
(1)
Power Dissipation
(2)
ESD Standoff Voltage
Non-Operating, Unbiased, Human Body Model
(3)
Thermal Resistance
Junction-to-Ambient
(4)
Junction-to-Ambient
(2)
Junction-to-Exposed-Pad
THERMAL RATINGS
Operating Ambient Temperature
Operating Junction Temperature
Input Power Supply Voltage
I
B
+
= 0.0 A to 3.0 A
Quiescent Bias Current from B+
(5)
V
B
+
= 13 V to 32 V
V
I /O
SWITCHING REGULATOR
(6)
Maximum Output Voltage Startup Overshoot (C
OUT
= 330
µF)
Mode0 = 0
Mode0 = Open
Maximum Output Current
T
A
= 0°C to 105°C
I
VI/O
700
V
I / O
(
STARTUP
)
5.4
3.6
mA
V
I
B+
(
Q
)
7.5
T
A
T
J
V
B
+
13 to 32
mA
0 to 85
0 to 105
°C
°C
V
V
ESD1
R
θ
JA
R
θ
JA
R
θ
JC
±2000
°C/W
45
25
2.0
T
SOLDER
P
D
V
B
+
-0.3 to 36
260
3.0
°C
W
V
V
Symbol
Max
Unit
Notes
1. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
2.
3.
4.
5.
6.
With 2.0 in
2
of copper heatsink.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω).
With no additional heatsinking.
Maximum quiescent power dissipation is 0.25 W.
13 V
≤
V
B+
≤
32 V and - 20°C
≤
T
J
≤
145°C unless otherwise noted
.
34710
4
Analog Integrated Circuit Device Data
Freescale Semiconductor