ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Analog Signal Input (1)
VBATT
VINAN
-0.5 to 5.0
V
V
V
-0.5 to VO1+0.5
Logic Signal Input
WAKE1~4B
VILRSTB
VILGC
-0.5 to V_STDBY+0.5
-0.5 to VO1_SENSE+0.5
-0.5 to VBATT+0.5
CLEAR, SLEEP, EXT_CLOCK, SCKIN, DATA, STRB
VGATESEL1,2
VILGSEL
Output Power Current
mA
VOUT1 Power Supply Circuit (2)
VOUT2 Power Supply Circuit
SREG1 Power Supply Circuit
SREG2 Power Supply Circuit
SREG3 Power Supply Circuit
VGATE Power Supply Circuit
PGOOD1 Power Supply Circuit
IOVO1
IOVO2
120
100
80
IOREG1
IOREG2
IOREG3
IOVG
100
80
8
IOPGOOD1
-20
Open-Drain Output Apply Voltage
V
V
PGOOD1
LSWO
VIODR
VIODV
-0.5 to 3.3
-0.5 to 3.3
ESD Voltage (3)
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
V
V
±1500
± 200
± 750
ESD1
ESD2
VCDM
THERMAL RATINGS
Operating Temperature
Ambient
°C
T
-10 to 65
150
A
Junction
T
J
Storage Temperature
TSTG
-50 to 150
69
°C
Thermal Resistance (4)
Junction to Ambient
R
°C/W
θJA
Lead Soldering Temperature(5)
T
260
°C
SOLDER
Notes
1. VREF, DMAX1, DMAX2, SREGC1, SREGC2, SREGC3 and RESET1_TH.
2. Includes the series pass power supply circuit output current
3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM)
(CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0pF).
4. Device mounted on a 2s2p test board, in accordance with JEDEC JESD51-6 and JESD51-7.
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
18730
Analog Integrated Circuit Device Data
Freescale Semiconductor
6
FREESCALE [ Freescale ]
