Ethernet: Three-Speed Ethernet, MII Management
Figure 16 shows the RBMII and RTBI AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKRGT
TXD[8:5][3:0]
TXD[7:4][3:0]
TXD[8:5]
TXD[7:4]
TXD[3:0]
TXD[9]
TXERR
TXD[4]
TXEN
TX_CTL
tSKRGT
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[8:5]
RXD[7:4]
RXD[3:0]
tSKRGT
RXD[9]
RXERR
RXD[4]
RXDV
RX_CTL
tSKRGT
RX_CLK
(At PHY)
Figure 16. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to the MII management interface signals management
data input/output (MDIO) and management data clock (MDC). The electrical characteristics for GMII,
RGMII, TBI and RTBI are specified in Section 8.1, “Three-Speed Ethernet Controller
(TSEC)—GMII/MII/TBI/RGMII/RTBI Electrical Characteristics.”
8.3.1
MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 2.5 or 3.3 V. The DC electrical
characteristics for MDIO and MDC are provided in Table 32 and Table 33.
Table 32. MII Management DC Electrical Characteristics Powered at 2.5 V
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage (2.5 V)
Output high voltage
Output low voltage
Input high voltage
Input low voltage
LVDD
VOH
VOL
VIH
—
2.37
2.00
2.63
LVDD + 0.3
0.40
V
V
V
V
V
IOH = –1.0 mA
LVDD = Min
LVDD = Min
LVDD = Min
LVDD = Min
IOL = 1.0 mA
GND – 0.3
1.7
—
—
—
VIL
–0.3
0.70
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
31