ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Charger and USB Input Voltage(5)
MODE pin Voltage
VCHRGR
VMODE
-0.3 to 20
-0.3 to 9.0
-0.3 to 28
V
V
V
Main/Aux/Keypad Current Sink Voltage
V
LEDMD,
V
LEDAD,
V
LEDKP
Battery Voltage
Coin Cell Voltage
ESD Voltage(6)
VBATT
-0.3 to 4.8
-0.3 to 3.6
V
V
V
VLICELL
V
ESD
Human Body Model - HBM with Mode pin excluded(9)
Charge Device Model - CDM
±1500
±250
THERMAL RATINGS
Ambient Operating Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
T
-40 to +85
-40 to +125
-65 to +150
°C
°C
°C
A
T
J
T
STG
THERMAL RESISTANCE
(8)
Peak Package Reflow Temperature During Reflow(7)
,
°C
TPPRT
Note 8
Notes
5. USB Input Voltage applies to UVBUS pin only
6. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 W) and the Charge Device
Model (CDM), Robotic (CZAP = 4.0pF).
7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
9. Mode Pin is not ESD protected.
Table 4. Dissipation Ratings
Rating Parameter
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Condition
Symbol
VK Package
VL Package
Unit
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
RθJA
RθJMA
RθJMA
RθJMA
RθJB
104
54
65
42
55
38
28
22
5.0
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
88
49
32
Junction to Case
RθJC
29
Junction to Package Top
Natural Convection
θJT
7.0
13892
Analog Integrated Circuit Device Data
Freescale Semiconductor
11