ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
ELECTRICAL RATINGS
V
PWR
Supply Voltage Range
Load Dump at 25 °C (400 ms)
Maximum Operating Voltage
Reverse Battery at 25 °C (2.0 min.)
V
DD
Supply Voltage Range
Input / Output Voltage
WAKE Input Clamp Current
CSNS Input Clamp Current
HS [0:3] Voltage
Positive
Negative
Output Current
Output Clamp Energy Using Single-pulse Method
ESD Voltage
Human Body Model (HBM) for HS[0:3], VPWR and GND
Human Body Model (HBM) for other pins
Charge Device Model (CDM)
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Storage Temperature
T
A
T
J
T
STG
- 40 to 125
- 40 to 150
- 55 to 150
V
ESD1
V
ESD2
V
ESD3
V
ESD4
± 8000
± 2000
± 750
± 500
I
HS[0:3]
E
CL [0:3]
V
DD
Symbol
Value
Unit
V
PWR(SS)
41
28
-18
-0.3 to 5.5
-0.3 to V
DD
+ 0.3
2.5
2.5
V
V
V
mA
mA
V
I
CL(WAKE)
I
CL(CSNS)
V
HS[0:3]
41
-16
6
100
A
mJ
V
°
C
°
C
Notes
3. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
4. Active clamp energy using single-pulse method (L = 2.0 mH, R
L
= 0
Ω,
V
PWR
= 14 V, T
J
= 150
°
C initial).
5.
6.
ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω),
the Machine Model (MM)
(C
ZAP
= 200 pF, R
ZAP
= 0
Ω),
and the Charge Device Model (CDM), Robotic (C
ZAP
= 4.0 pF).
Input / Output pins are: IN[0:3], RSTB, FSI, CSNS, SI, SCLK, CSB, SO, FSB
10XS3412
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
