ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are relative to ground unless mentioned otherwise. Exceeding these ratings may cause permanent damage.
Parameter
ELECTRICAL RATINGS
VPWR Supply Voltage Range
Voltage Transient at 25 °C (500 ms)
Reverse Voltage at 25 °C
Fast Negative Transient Pulses (ISO 7637-2 pulse #1, V
PWR
=14V & Ri=10)
VDD Supply Voltage Range
Voltage on Input pins
(except IN[0:1]) and Output pins
(except HS[0:1])
Voltage on Fail-safe Output (FSOB)
Voltage on SO pin
Voltage (continuous, max. allowable) on IN[0:1] Inputs
Voltage (continuous, max. allowable) on output pins (HS [0:1]),
Rated Continuous Output Current per channel
Maximum allowable energy dissipation per channel and two parallel channels,
single-pulse method
Maximum allowable energy dissipation per channel and two parallel channels,
repetitive-pulses condition. 1
Maximum allowable energy dissipation per channel and two parallel channels,
repetitive-pulses condition. 2
ESD Voltage
Human Body Model (HBM) for HS[0:1], VPWR and GND
Human Body Model (HBM) for other pins
Charge Device Model (CDM)
Package Corner pins (1, 13, 19, 20)
All Other pins
V
ESD1
V
ESD2
V
ESD3
V
ESD4
± 8000
± 2000
± 750
± 500
V
DD
V
MAX,LOGIC(1)
V
FSO
V
SO
V
IN,MAX
V
HS[0:1]
I
HS[0:1]
E
CL [0:1]_SING
E
CL [0:1]_REP1
E
CL [0:1]_REP2
V
PWR
58
-28
-60
-0.3 to 5.5
-0.3 to 5.5
-0.3 to 58
-0.3 to V
DD
+0.3
58
-28 to 58
9.0
480
350
350
V
V
V
V
V
V
A
mJ
mJ
mJ
V
V
Symbol
Maximum ratings
Unit
Notes:
1. Concerned Input pins are: CONF[0:1], RSTB, SI, SCLK, Clock, and CSB.
2. Concerned Output pins are: CSNS, SYNC, and FSB.
3. Output current rating valid as long as maximum junction temperature is not exceeded. For computation of the maximum allowable output
current, the thermal resistance of the package & the underlying heatsink must be taken into account
4. Single pulse Energy dissipation, Single-pulse short-circuit method (L
L
= 2.0 mH, R = 30 mV
PWR
= 28 V, T
J
= 150
C initial).
5.
6.
7.
Dissipation during repetitive cycles: switch off upon short-circuit (L
L
= 20 µH, R = 200 mV
PWR
= 28 V, T
J
= 125
C initial, f
S
<2.0 Hz).
Dissipation during repetitive cycles: switch off upon short-circuit (L
L
= 40 µH, R = 400 mV
PWR
= 28 V, T
J
= 125
C initial, f
S
<2.0 Hz).
ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500
),
and the Charge Device
Model (CDM), Robotic (C
ZAP =
4.0 pF).
06XSD200
6
Analog Integrated Circuit Device Data
Freescale Semiconductor