1.1.3 Bending the lead
(1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a
crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6).
(2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7).
D
0.5mm
0.5mm
L > D
Solder
Printed circuit
Solder
board
L
Solder
Figure 5
Figure 6
Figure 7
Soldering directly to the case will reduce the degree of vacuum and may result in
deterioration of the characteristics and may break the crystal chip.
Make the length from the
case to the printed circuit
board (L) longer than the
case diameter (D) so that
the lead wire will not be
pulled in case the crystal
unit falls over.
1.1.4 Soldering
When mounting or removing a quartz crystal unit, heat the lead part at 300°C or lower for 5 seconds or less (in the case of a
lead-type conventional product). A long period of time of heating may result in deterioration of the characteristics and may
break the crystal unit. Be sure to keep the case at or below 150°C.
Page 2 of 2
7/7/2011
FOX [ FOX ELECTRONICS ]
