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FPD2000AS-EB 参数 Datasheet PDF下载

FPD2000AS-EB图片预览
型号: FPD2000AS-EB
PDF下载: 下载PDF文件 查看货源
内容描述: PACKAGED 2W功率PHEMT [2W PACKAGED POWER PHEMT]
分类和应用:
文件页数/大小: 10 页 / 417 K
品牌: FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
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FPD2000AS  
Datasheet v3.0  
1
ABSOLUTE MAXIMUM RATING :  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
Drain-Source Current  
Gate Current  
SYMBOL  
VDS  
TEST CONDITIONS  
ABSOLUTE MAXIMUM  
7
-3V < VGS < -0.5V  
12V  
VGS  
0V < VDS < +8V  
For VDS < 2V  
-3V  
IDS  
IDSS  
IG  
Forward / reverse current  
Under any acceptable bias state  
Under any acceptable bias state  
Non-Operating Storage  
See De-Rating Note below  
+15/-2mA  
29.5dBm  
175°C  
2
RF Input Power  
PIN  
Channel Operating Temperature  
Storage Temperature  
TCH  
TSTG  
PTOT  
-40°C to 150°C  
7.6W  
3
Total Power Dissipation  
Notes:  
1 TAmbient = 22°C unless otherwise noted; exceeding any one of these absolute maximum ratings may cause  
permanent damage to the device; Users should avoid exceeding 80% of 2 or more Limits simultaneously  
2 Max. RF Input Limit must be further limited if input VSWR > 2.5:1  
3 Total Power Dissipation defined as: PTOT (PDC + PIN) – POUT  
,
where PDC: DC Bias Power, PIN: RF Input Power, POUT: RF Output Power  
Total Power Dissipation to be de-rated as follows above 22°C:  
PTOT= 7.6 - (0.05W/°C) x TPACK  
where TPACK= source tab lead temperature above 22°C  
(Coefficient of de-rating formula is the Thermal Conductivity)  
Example: For a 55°C carrier temperature: PTOT = 7.6W – (0.05 x (55 – 22)) = 5.95W  
5 For optimum heat sinking, metal-filled through (Source) via holes should be used directly below the central  
metallized ground pad on the bottom of the package  
6 Thermal Resistivity: The nominal value of 20°C/W is measured with the package mounted on a large heatsink  
with thermal compound to ensure adequate (unsoldered) contact. The package temperature is referred to the  
Source leads  
7 Operating at absolute maximum VD continuously is not recommended. If operation is considered then IDS must  
be reduced in order to keep the part within it's thermal power dissipation limits. Therefore VGS is restricted  
to <-0.5V.  
BIASING GUIDELINES:  
Active bias circuits provide good performance stabilization over variations of operating  
temperature, but require a larger number of components compared to self-bias or dual-biased.  
Such circuits should include provisions to ensure that Gate bias is applied before Drain bias,  
otherwise the pHEMT may be induced to self-oscillate.  
Dual-bias circuits are relatively simple to implement, but will require a regulated negative voltage  
supply for depletion-mode devices such as the FPD2000AS.  
The recommended 350mA bias point is nominally a Class AB mode. A small amount of RF gain  
expansion prior to the onset of compression is normal for this operating point.  
RECOMMENDED OPERATING BIAS CONDITIONS:  
Drain-Source Voltage:  
Quiescent Current:  
From 5V to 10V  
From 25% IDSS to 55% IDSS  
2
Specifications subject to change without notice  
Filtronic Compound Semiconductors Ltd  
Tel: +44 (0) 1325 301111  
Fax: +44 (0) 1325 306177  
Email: sales@filcs.com  
Website: www.filtronic.com  
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