Datasheet v3.0
DEVICE FOOT PRINT:
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters, noise parameters and device
model are available on request.
RELIABILITY:
A MTTF of 7.4 million hours at a channel
temperature of 150°C is achieved for the
process used to manufacture this device.
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
Units in inches
NOTE: Drawing available on Website
ORDERING INFORMATION:
PREFERRED ASSEMBLY INSTRUCTIONS:
This package is compatible with both lead free
and leaded solder reflow processes as defined
within IPC/JEDEC J-STD-020C. The maximum
package temperature should not exceed
260°C.
PART
DESCRIPTION
NUMBER
FPD1500SOT89
FPD1500SOT89E
FPD1500SOT89CE
Packaged pHEMT
RoHS Compliant Packaged pHEMT
HANDLING PRECAUTIONS:
To avoid damage to
RoHS Compliant Packaged pHEMT with
enhanced passivation (Recommended for New
Designs)
the
devices
care
EB1500SOT89(E)-BB
EB1500SOT89(E)-BA
EB1500SOT89(E)-BC
EB1500SOT89(E)-BD
EB1500SOT89(E)-BE
EB1500SOT89(E)-BG
EB1500SOT89(E)-AJ
0.9 GHz evaluation board
1.85 GHz evaluation board
2.0 GHz evaluation board
2.2 GHz evaluation board
2.4 GHz evaluation board
2.6 GHz evaluation board
5.3-5.75 GHz evaluation board
should be exercised
during
Proper
precautions should be observed at all stages of
storage, handling, assembly, and testing.
handling.
Electrostatic
Discharge
(ESD)
ESD/MSL RATING:
These devices should be treated as Class 0 (0-
250 V) using the human body model as
defined in JEDEC Standard No. 22-A114.
The device has a MSL rating of Level 2. To
determine this rating, preconditioning was
performed to the device per, the Pb-free solder
profile defined within IPC/JEDEC J-STD-020C,
Moisture / Reflow sensitivity classification for
non-hermatic solid state surface mount
devices.
12
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com