Datasheet v3.0
PREFERRED ASSEMBLY INSTRUCTIONS:
ORDERING INFORMATION:
This package is compatible with both lead free
and leaded solder reflow processes as defined
within IPC/JEDEC J-STD-020C. The maximum
package temperature should not exceed
260°C. Package leads are gold plated.
PART NUMBER
FPD1000AS
DESCRIPTION
Packaged pHEMT
FPD1000AS-EB
Packaged pHEMT evaluation board
EB-1000AS-AB (880MHz)
EB-1000AS-AA (1.85GHz)
EB-1000AS-AD (2.14GHz)
EB-1000AS-AG (2.5 to 2.7GHz)
EB-1000AS-AH (3.5GHz)
HANDLING PRECAUTIONS:
To avoid damage to
the
devices
care
should be exercised
during
Proper
handling.
Electrostatic
Discharge
(ESD)
precautions should be observed at all stages
of storage, handling, assembly, and testing.
ESD/MSL RATING:
These devices should be treated as Class 1A
(250-500 V) as defined in JEDEC Standard
No. 22-A114. Further information on ESD
control measures can be found in MIL-STD-
1686 and MIL-HDBK-263.
The device has a MSL rating of Level 1. To
determine this rating, preconditioning was
performed to the device per, the Pb-free solder
profile defined within IPC/JEDEC J-STD-020C,
Moisture / Reflow sensitivity classification for
non-hermatic solid state surface mount devices
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters, noise parameters and device
model are available on request.
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
11
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
