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FMS2029-000-WP 参数 Datasheet PDF下载

FMS2029-000-WP图片预览
型号: FMS2029-000-WP
PDF下载: 下载PDF文件 查看货源
内容描述: DC- 20 GHz的MMIC SPST吸收式开关 [DC-20 GHZ MMIC SPST ABSORPTIVE SWITCH]
分类和应用: 射频和微波开关射频开关微波开关
文件页数/大小: 5 页 / 201 K
品牌: FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
 浏览型号FMS2029-000-WP的Datasheet PDF文件第1页浏览型号FMS2029-000-WP的Datasheet PDF文件第2页浏览型号FMS2029-000-WP的Datasheet PDF文件第3页浏览型号FMS2029-000-WP的Datasheet PDF文件第4页  
FMS2029  
Pre-Production Datasheet v3.0  
PREFERRED ASSEMBLY INSTRUCTIONS:  
HANDLING PRECAUTIONS:  
To avoid damage to  
GaAs devices are fragile and should be  
handled with great care. Specially designed  
collets should be used where possible.  
the  
devices  
care  
should be exercised  
during  
Proper  
handling.  
Electrostatic  
The back of the die is metallised and the  
recommended mounting method is by the use  
of conductive epoxy. Epoxy should be applied  
to the attachment surface uniformly and  
sparingly to avoid encroachment of epoxy on  
to the top face of the die and ideally should not  
exceed half the chip height. For automated  
dispense Ablestick LMISR4 is recommended  
and for manual dispense Ablestick 84-1 LMI or  
84-1 LMIT are recommended. These should be  
cured at a temperature of 150°C for one hour  
in an oven especially set aside for epoxy  
curing only. If possible the curing oven should  
be flushed with dry nitrogen. Eutectic die  
attach is not recommended.  
Discharge  
(ESD)  
precautions should be observed at all stages  
of storage, handling, assembly, and testing.  
These devices should be treated as Class 1A  
(250-500 V) as defined in JEDEC Standard  
No. 22-A114. Further information on ESD  
control measures can be found in MIL-STD-  
1686 and MIL-HDBK-263.  
APPLICATION NOTES & DESIGN DATA:  
Application Notes and design data including S-  
parameters are available on request.  
This part has gold (Au) bond pads requiring  
the use of gold (99.99% pure) bondwire. It is  
recommended that 25.4µm diameter gold wire  
be used. Thermosonic ball bonding is  
preferred. A nominal stage temperature of  
150°C and a bonding force of 40g has been  
shown to give effective results for 25µm wire.  
Ultrasonic energy shall be kept to a minimum.  
For this bonding technique, stage temperature  
should not be raised above 200°C and bond  
force should not be raised above 60g.  
DISCLAIMERS:  
This product is not designed for use in any  
space based or life sustaining/supporting  
equipment.  
ORDERING INFORMATION:  
PART NUMBER  
DESCRIPTION  
Thermosonic  
wedge  
bonding  
and  
thermocompression wedge bonding can also  
be used to achieve good wire bonds.  
FMS2029-000-WP  
Die in Waffle-pack  
(Gel-pak available on  
request)  
Bonds should be made from the die first and  
then to the mounting substrate or package.  
The physical length of the bondwires should be  
minimised especially when making RF or  
ground connections.  
5
Specifications subject to change without notice  
Filtronic Compound Semiconductors Ltd  
Tel: +44 (0) 1325 301111  
Fax: +44 (0) 1325 306177  
Email: sales@filcs.com  
Website: www.filtronic.com