Pre-Production Datasheet v3.0
ABSOLUTE MAXIMUM RATINGS:
TRUTH TABLE:
ABSOLUTE
MAXIMUM
PARAMETER
SYMBOL
Pin
CONTROL LINE
RF PATH
Max Input
Power
+27dBm
V1
V2
RFIN-RFO
-5V
0V
0V
On (Low Loss)
Off (Isolation)
Operating
Temp
-40°C to
+85°C
Toper
Tstor
-5V
-55°C to
+150°C
Storage Temp
Note: -5V ± 0.2V; 0V ± 0.2V
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PIN
COORDINATES
(µm)
PAD LAYOUT:
PAD
DESCRIPTION
NAME
RFIN
RFO
V1
RFIN
RFOUT
V1
141,587
1789,587
901,161
1101,161
V2
V2
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
MIN. BOND PAD PITCH
MIN. BOND PAD OPENING
(µm x µm )
DIE SIZE (µm)
DIE THICKNESS (µm)
(µm)
1910 x 1110
100
150
116 x 116
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
